Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8071887 | Printed circuit board and method for manufacturing same | Yao-Wen Bai, Cheng-Hsien Lin | 2011-12-06 |
| 8052881 | Method of manufacturing multilayer printed circuit board having buried holes | Yun Zhu, Yung-Wei Lai | 2011-11-08 |
| 7998332 | Electroplating method | Yao-Wen Bai, Rui Zhang, QIU-YUE ZHANG | 2011-08-16 |
| 7985482 | Stiffener sheet and flexible printed circuit board using the same | Yung-Wei Lai, Cheng-Wei Kuo | 2011-07-26 |