Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7977783 | Wafer level chip size package having redistribution layers | No Sun Park, Jae Beom Shim | 2011-07-12 |
| 7944043 | Semiconductor device having improved contact interface reliability and method therefor | Jae Yoon Kim, Tae Yong Lee | 2011-05-17 |