Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7977783 | Wafer level chip size package having redistribution layers | No Sun Park, Young Suk Chung | 2011-07-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7977783 | Wafer level chip size package having redistribution layers | No Sun Park, Young Suk Chung | 2011-07-12 |