NP

No Sun Park

AT Amkor Technology: 1 patents #32 of 104Top 35%
📍 Gwangju-si, KR: #6 of 30 inventorsTop 20%
Overall (2011): #202,721 of 364,097Top 60%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7977783 Wafer level chip size package having redistribution layers Young Suk Chung, Jae Beom Shim 2011-07-12