Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084088 | Method of improving the wafer-to-wafer thickness uniformity of silicon nitride layers | Katja Huy, Michael D. Turner | 2011-12-27 |
| 7998882 | Particle reduction in PECVD processes for depositing low-k material by using a plasma assisted post-deposition step | Ulrich Mayer | 2011-08-16 |