Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8043976 | Adhesion to copper and copper electromigration resistance | Laura M. Matz, Mark Leonard O'Neill | 2011-10-25 |
| 7943195 | Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants | Mark Leonard O'Neill, Jean Louise Vincent, Aaron Scott Lukas, Manchao Xiao, John Anthony Thomas Norman | 2011-05-17 |
| 7932188 | Mechanical enhancement of dense and porous organosilicate materials by UV exposure | Aaron Scott Lukas, Mark Leonard O'Neill, Jean Louise Vincent, Mark Daniel Bitner, Eugene Joseph Karwacki, Jr. | 2011-04-26 |