Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7985626 | Manufacturing tool for wafer level package and method of placing dies | Wen-Pin Yang, Shih-Li Chen | 2011-07-26 |
| 7911044 | RF module package for releasing stress | Chun-Hui Yu, Chihwei Lin | 2011-03-22 |
| 7863105 | Image sensor package and forming method of the same | Jui-Hsien Chang | 2011-01-04 |