Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7911044 | RF module package for releasing stress | Wen-Kun Yang, Chihwei Lin | 2011-03-22 |
| 7884461 | System-in-package and manufacturing method of the same | Dyi-Chung Hu | 2011-02-08 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7911044 | RF module package for releasing stress | Wen-Kun Yang, Chihwei Lin | 2011-03-22 |
| 7884461 | System-in-package and manufacturing method of the same | Dyi-Chung Hu | 2011-02-08 |