WY

Wen-Pin Yang

AT Advanced Chip Engineering Technology: 1 patents #3 of 13Top 25%
📍 Lawrenceville, NJ: #15 of 72 inventorsTop 25%
🗺 New Jersey: #1,952 of 6,350 inventorsTop 35%
Overall (2011): #132,303 of 364,097Top 40%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7985626 Manufacturing tool for wafer level package and method of placing dies Wen-Kun Yang, Shih-Li Chen 2011-07-26