Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6872619 | Semiconductor device having trench top isolation layer and method for forming the same | Yi-Nan Chen, Tieh-Chiang Wu | 2005-03-29 |
| 6844616 | Multi-chip semiconductor package structure | Kuang-Ho Liao, Yun-Sheng Chen | 2005-01-18 |