Issued Patents 2005
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6979638 | Conducting wire and contact opening forming method for reducing photoresist thickness and via resistance | Tse-Yao Huang, Chiang-Lin Shih | 2005-12-27 |
| 6977134 | Manufacturing method of a MOSFET gate | Chung-Peng Hao, Hui-Min Mao, Tzu-Ching Tsai | 2005-12-20 |
| 6974741 | Method for forming shallow trench in semiconductor device | Hsiu-Chun Lee, Tse-Yao Huang | 2005-12-13 |
| 6969881 | Partial vertical memory cell and method of fabricating the same | Ming-Cheng Chang, Yi-Chen Chen | 2005-11-29 |
| 6964926 | Method of forming geometric deep trench capacitors | Tse-Yao Huang, Tzu-Ching Tsai | 2005-11-15 |
| 6960525 | Method of forming metal plug | Hui-Min Mao | 2005-11-01 |
| 6960530 | Method of reducing the aspect ratio of a trench | Chang-Rong Wu, Kuo-Chien Wu, Hung-Chang Liao | 2005-11-01 |
| 6958521 | Shallow trench isolation structure | Ming-Cheng Chang, Jeng-Ping Lin | 2005-10-25 |
| 6953723 | Method for forming bottle shaped trench | Shih-Chung Chou | 2005-10-11 |
| 6946344 | Method for forming trench capacitor | Shih-Chung Chou, Tzu-Ching Tsai | 2005-09-20 |
| 6929902 | Method of preventing repeated collapse in a reworked photoresist layer | Yuan-Hsun Wu, Teng-Yen Huang, Wen-Bin Wu | 2005-08-16 |
| 6929996 | Corner rounding process for partial vertical transistor | Chung-Peng Hao, Ming-Cheng Chang | 2005-08-16 |
| 6929998 | Method for forming bottle-shaped trench | Hsin-Chuan Tsai | 2005-08-16 |
| 6924204 | Split gate flash memory cell and manufacturing method thereof | Tzu-Ching Tsai | 2005-08-02 |
| 6919245 | Dynamic random access memory cell layout and fabrication method thereof | Ming-Cheng Chang, Tieh-Chiang Wu, Jeng-Ping Lin | 2005-07-19 |
| 6916703 | Method for forming uniform bottom electrode in trench of trench capacitor | Yi-Chen Chen | 2005-07-12 |
| 6908840 | Method of filling bit line contact via | Tse-Yao Huang | 2005-06-21 |
| 6900118 | Method for preventing contact defects in interlayer dielectric layer | Kaan-Lu Tzou, Yan Chen, Chang-Rong Wu | 2005-05-31 |
| 6884714 | Method of forming shallow trench isolation with chamfered corners | Tse-Yao Huang, Chung-Peng Hao | 2005-04-26 |
| 6881670 | Interconnect process and method for removing metal silicide | Tien-Sung Chen, Jin-Tau Huang | 2005-04-19 |
| 6872629 | Method of forming a memory cell with a single sided buried strap | Chih-Yuan Hsiao | 2005-03-29 |
| 6872619 | Semiconductor device having trench top isolation layer and method for forming the same | Tieh-Chiang Wu, Feng Lin | 2005-03-29 |
| 6867142 | Method to prevent electrical shorts between tungsten interconnects | Shing-Yih Shih, Hsien-Wen Liu | 2005-03-15 |
| 6867089 | Method of forming a bottle-shaped trench in a semiconductor substrate | Tung-Wang Huang, Hsin-Jung Ho, Hsien-Wen Liu | 2005-03-15 |
| 6861333 | Method of reducing trench aspect ratio | Chang-Rong Wu, Seng-Hsiung Wu | 2005-03-01 |