SL

Shelton Lu

VT Via Technologies: 1 patents #41 of 142Top 30%
📍 Baoshan, TW: #80 of 337 inventorsTop 25%
Overall (2005): #102,606 of 245,428Top 45%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6965169 Hybrid integrated circuit package substrate Kenny Chang 2005-11-15