Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6965169 | Hybrid integrated circuit package substrate | Shelton Lu | 2005-11-15 |
| 6909187 | Conductive wiring layer structure | Yuangtsang Liaw, Hung-Yin Tsai | 2005-06-21 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6965169 | Hybrid integrated circuit package substrate | Shelton Lu | 2005-11-15 |
| 6909187 | Conductive wiring layer structure | Yuangtsang Liaw, Hung-Yin Tsai | 2005-06-21 |