Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6975489 | Circuit structure and semiconductor integrated circuit | Kanji Otsuka, Tamotsu Usami | 2005-12-13 |
| 6935553 | Reflow soldering method | Keisuke Saito, Yoshikazu Matsuura, Tatsuya Takeuchi, Johji Kagami, Rikiya Kato +1 more | 2005-08-30 |
| 6887319 | Residue-free solder paste | Keisuke Saito, Rikiya Kato, Sakie Yamagata | 2005-05-03 |