Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6935553 | Reflow soldering method | Tadatomo Suga, Keisuke Saito, Yoshikazu Matsuura, Tatsuya Takeuchi, Johji Kagami +1 more | 2005-08-30 |
| 6887319 | Residue-free solder paste | Tadatomo Suga, Keisuke Saito, Sakie Yamagata | 2005-05-03 |