Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6968613 | Fabrication method of circuit board | Jin-Chuan Bai | 2005-11-29 |
| 6911604 | Bonding pads of printed circuit board capable of holding solder balls securely | Wei Shan | 2005-06-28 |
| 6857865 | Mold structure for package fabrication | Wei Shan | 2005-02-22 |
| 6849915 | Light sensitive semiconductor package and fabrication method thereof | — | 2005-02-01 |
| 6849932 | Double-sided thermally enhanced IC chip package | Wei Shan | 2005-02-01 |