Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6911604 | Bonding pads of printed circuit board capable of holding solder balls securely | Chung-Che Tsai | 2005-06-28 |
| 6857865 | Mold structure for package fabrication | Chung-Che Tsai | 2005-02-22 |
| 6849932 | Double-sided thermally enhanced IC chip package | Chung-Che Tsai | 2005-02-01 |