Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6942750 | Low-temperature patterned wafer bonding with photosensitive benzocyclobutene (BCB) and 3D MEMS (microelectromechanical systems) structure fabrication | Tsung-Kuan A. Chou, Khalil Najafi, Luis P. Bernal | 2005-09-13 |