Issued Patents 2005
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6962831 | Method of making a thick microstructural oxide layer | Chunbo Zhang | 2005-11-08 |
| 6958531 | Multi-substrate package and method for assembling same | Asli Buccu Ucok, Joseph M. Giachino | 2005-10-25 |
| 6942750 | Low-temperature patterned wafer bonding with photosensitive benzocyclobutene (BCB) and 3D MEMS (microelectromechanical systems) structure fabrication | Tsung-Kuan A. Chou, Luis P. Bernal, Peter D. Washabaugh | 2005-09-13 |
| 6938484 | Micromachined capacitive lateral accelerometer device and monolithic, three-axis accelerometer having same | Junseok Chae | 2005-09-06 |
| 6939778 | Method of joining an insulator element to a substrate | Timothy J. Harpster | 2005-09-06 |
| 6884732 | Method of fabricating a device having a desired non-planar surface or profile and device produced thereby | Chou Tsung-Kuan | 2005-04-26 |