Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6955981 | Pad structure to prompt excellent bondability for low-k intermetal dielectric layers | Tze-Liang Lee | 2005-10-18 |
YH
Yun-San Huan
Overall (2005): #69,132 of 245,428Top 30%
1
Patents 2005