Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6960518 | Buildup substrate pad pre-solder bump manufacturing | Pei-Haw Tsao, Chender Huang, Jones Wang, Ken-Ching Chen | 2005-11-01 |
| 6884662 | Enhanced adhesion strength between mold resin and polyimide | Ken-Ching Chen, Chender Huang, Pei-Haw Tsao, Jones Wang | 2005-04-26 |