Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6960518 | Buildup substrate pad pre-solder bump manufacturing | Pei-Haw Tsao, Jones Wang, Ken-Ching Chen, Hank Huang | 2005-11-01 |
| 6939789 | Method of wafer level chip scale packaging | Pei-Haw Tsao, Jones Wang, Ken-Ching Chen | 2005-09-06 |
| 6884662 | Enhanced adhesion strength between mold resin and polyimide | Ken-Ching Chen, Pei-Haw Tsao, Jones Wang, Hank Huang | 2005-04-26 |