Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6897147 | Solution for copper hillock induced by thermal strain with buffer zone for strain relaxation | Shin-Yeu Tsai, Po-Hsiung Leu, Chia-Ming Yang, Tsang-Yu Liu, Yun-Da Fan | 2005-05-24 |