Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6897147 | Solution for copper hillock induced by thermal strain with buffer zone for strain relaxation | Shin-Yeu Tsai, Po-Hsiung Leu, Tsang-Yu Liu, Yun-Da Fan, Chen-Peng Fan | 2005-05-24 |
| 6847111 | Semiconductor device with heat-dissipating capability | Shu-Fen Liang, Shu-Min Chou | 2005-01-25 |