Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6933600 | Substrate for semiconductor package | Kuei-Chen Liang, Wei-Feng Lin | 2005-08-23 |
| 6882037 | Die paddle for receiving an integrated circuit die in a plastic substrate | Wei-Feng Lin, Wei-Chi Liu | 2005-04-19 |
| 6838756 | Chip-packaging substrate | Wei-Feng Lin, Chen-Wen Tsai | 2005-01-04 |