Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6933600 | Substrate for semiconductor package | Chung-Ju Wu, Kuei-Chen Liang | 2005-08-23 |
| 6882037 | Die paddle for receiving an integrated circuit die in a plastic substrate | Wei-Chi Liu, Chung-Ju Wu | 2005-04-19 |
| 6864586 | Padless high density circuit board | Han-Kun Hsieh | 2005-03-08 |
| 6838756 | Chip-packaging substrate | Chung-Ju Wu, Chen-Wen Tsai | 2005-01-04 |