Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6958544 | Semiconductor device and method of manufacturing the same | — | 2005-10-25 |
| 6943442 | Electronic parts packaging structure having mutually connected electronic parts that are buried in a insulating film | Kei Murayama, Naohiro Mashino, Mitsutoshi Higashi | 2005-09-13 |
| 6930392 | Electronic parts packaging structure and method of manufacturing the same | Kei Murayama, Mitsutoshi Higashi | 2005-08-16 |
| 6875672 | Method of manufacturing a semiconductor device with penetration electrodes that protrude from a rear side of a substrate formed by thinning the substrate | Yoshihiko Nemoto, Tomonori Fujii, Tomotoshi Sato | 2005-04-05 |