Issued Patents 2005
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6974721 | Method for manufacturing thin semiconductor chip | Naoyuki Koizumi, Shigeru Mizuno, Takashi Kurihara | 2005-12-13 |
| 6958298 | Method for thinning wafer by grinding | — | 2005-10-25 |
| 6943442 | Electronic parts packaging structure having mutually connected electronic parts that are buried in a insulating film | Masahiro Sunohara, Naohiro Mashino, Mitsutoshi Higashi | 2005-09-13 |
| 6930392 | Electronic parts packaging structure and method of manufacturing the same | Masahiro Sunohara, Mitsutoshi Higashi | 2005-08-16 |
| 6864120 | Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion | Mitsutoshi Higashi, Hideaki Sakaguchi, Hiroko Koike | 2005-03-08 |
| 6861284 | Semiconductor device and production method thereof | Mitsutoshi Higashi, Hideaki Sakaguchi, Hiroko Koike | 2005-03-01 |