Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6926849 | Solder paste | Kunihito Takaura, Setsuko Tadokoro, Masahiko Hirata, Hisahiko Yoshida, Takashi Nagashima | 2005-08-09 |
| 6896172 | Lead-free solder paste for reflow soldering | Satoru Akita, Masato Shimamura, Ryoichi Suzuki, Tetsuya Okuno | 2005-05-24 |