TO

Tetsuya Okuno

SC Senju Metal Industry Co.: 1 patents #6 of 26Top 25%
Overall (2005): #90,135 of 245,428Top 40%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6896172 Lead-free solder paste for reflow soldering Toshihiko Taguchi, Satoru Akita, Masato Shimamura, Ryoichi Suzuki 2005-05-24