Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6951385 | Liquid ejecting head and method of manufacturing flow path forming plate in use of liquid ejecting head | — | 2005-10-04 |
| 6878609 | Silicon wafer break pattern, silicon substrate, and method of generating silicon wafer break pattern | Noriaki Okazawa, Yoshinao Miyata, Toshinao Shinbo, Tetsuya Akasu, Hisashi Akachi | 2005-04-12 |