Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6867070 | Bonding pad structure of a semiconductor device and method for manufacturing the same | Hyuck-Jin Kang, Min Chul Kim, Byung Yoon Kim | 2005-03-15 |
TC
Tai-Heui Cho
Overall (2005): #94,308 of 245,428Top 40%
1
Patents 2005