Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6867070 | Bonding pad structure of a semiconductor device and method for manufacturing the same | Tai-Heui Cho, Hyuck-Jin Kang, Byung Yoon Kim | 2005-03-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6867070 | Bonding pad structure of a semiconductor device and method for manufacturing the same | Tai-Heui Cho, Hyuck-Jin Kang, Byung Yoon Kim | 2005-03-15 |