HP

Hee Jin Park

Samsung: 1 patents #997 of 2,969Top 35%
Overall (2005): #191,298 of 245,428Top 80%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6857470 Stacked chip package with heat transfer wires Tae-Gyeong Chung, Eun-Chul Ahn 2005-02-22