EA

Eun-Chul Ahn

Samsung: 1 patents #997 of 2,969Top 35%
📍 Yongin-si, KR: #123 of 366 inventorsTop 35%
Overall (2005): #204,725 of 245,428Top 85%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6857470 Stacked chip package with heat transfer wires Hee Jin Park, Tae-Gyeong Chung 2005-02-22