Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6967127 | Methods for making semiconductor packages with leadframe grid arrays | Chan Min Yu, Ser Bok Leng, Low Siu Waf, Chia Yong Poo | 2005-11-22 |
| 6949407 | Castellation wafer level packaging of integrated circuit chips | Boon Suan Jeung, Chia Yong Poo, Low Siu Waf, Chua Swee Kwang, Huang Shuang Wu +2 more | 2005-09-27 |
| 6894386 | Apparatus and method for packaging circuits | Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Loo +4 more | 2005-05-17 |
| 6855572 | Castellation wafer level packaging of integrated circuit chips | Boon Suan Jeung, Chia Yong Poo, Low Siu Waf, Chua Swee Kwang, Huang Shuang Wu +2 more | 2005-02-15 |