Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6967127 | Methods for making semiconductor packages with leadframe grid arrays | Chan Min Yu, Ser Bok Leng, Chia Yong Poo, Eng Meow Koon | 2005-11-22 |
| 6949407 | Castellation wafer level packaging of integrated circuit chips | Boon Suan Jeung, Chia Yong Poo, Eng Meow Koon, Chua Swee Kwang, Huang Shuang Wu +2 more | 2005-09-27 |
| 6894386 | Apparatus and method for packaging circuits | Chia Yong Poo, Boon Suan Jeung, Chan Min Yu, Neo Yong Loo, Eng Meow Koon +4 more | 2005-05-17 |
| 6855572 | Castellation wafer level packaging of integrated circuit chips | Boon Suan Jeung, Chia Yong Poo, Eng Meow Koon, Chua Swee Kwang, Huang Shuang Wu +2 more | 2005-02-15 |
| 6841418 | Multi-substrate microelectronic packages and methods for manufacture | Boon Suan Jeung, Chia Yong Poo | 2005-01-11 |