Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6913951 | Method of making a lead-on-chip device | Etsuo Yamada, Kenji Nagasaki, Kazuhiko Sera | 2005-07-05 |
| 6911722 | Resin-molded semiconductor device having posts with bumps | Shinji Ohuchi, Yasuo Tanaka | 2005-06-28 |
| 6852564 | Semiconductor device and method of fabricating the same | Shinji Ohuchi, Harufumi Kobayashi | 2005-02-08 |