Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6911722 | Resin-molded semiconductor device having posts with bumps | Yasushi Shiraishi, Yasuo Tanaka | 2005-06-28 |
| 6852564 | Semiconductor device and method of fabricating the same | Harufumi Kobayashi, Yasushi Shiraishi | 2005-02-08 |