Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6967174 | Wafer chuck for use in edge bevel removal of copper from silicon wafers | Steve Taatjes, Andy McCutcheon, Jim Schall, Jingbin Feng | 2005-11-22 |
| 6964792 | Methods and apparatus for controlling electrolyte flow for uniform plating | R. Marshall Stowell, Evan E. Patton, Seshasayee Varadarajan | 2005-11-15 |
| 6946065 | Process for electroplating metal into microscopic recessed features | Vijay Bhaskaran, Evan E. Patton, Robert Jackson, Jonathan D. Reid | 2005-09-20 |
| 6919010 | Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction | — | 2005-07-19 |
| 6890416 | Copper electroplating method and apparatus | Evan E. Patton, Robert Jackson, Jonathan D. Reid | 2005-05-10 |