PS

Philip C. Smith

NG Northrop Grumman: 1 patents #47 of 284Top 20%
📍 Melbourne, FL: #21 of 78 inventorsTop 30%
🗺 Florida: #748 of 3,536 inventorsTop 25%
Overall (2005): #121,693 of 245,428Top 50%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6939784 Wafer scale package and method of assembly Li-Shu Chen, Thomas Moloney, Howard Fudem 2005-09-06