HF

Howard Fudem

NG Northrop Grumman: 1 patents #47 of 284Top 20%
📍 Baltimore, MD: #39 of 225 inventorsTop 20%
🗺 Maryland: #462 of 2,094 inventorsTop 25%
Overall (2005): #187,132 of 245,428Top 80%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6939784 Wafer scale package and method of assembly Li-Shu Chen, Philip C. Smith, Thomas Moloney 2005-09-06