Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6927249 | Heat absorb-release plastic resin composition and molded product thereof | Ju-Hyung Lee, Kyung-Mo Park, Duck-Kun Hwang, Chong-Koo Kum, Eung Soo Kim | 2005-08-09 |
HL
Heon Sang Lee
Overall (2005): #191,549 of 245,428Top 80%
1
Patents 2005