Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6927249 | Heat absorb-release plastic resin composition and molded product thereof | Heon Sang Lee, Ju-Hyung Lee, Kyung-Mo Park, Duck-Kun Hwang, Eung Soo Kim | 2005-08-09 |
CK
Chong-Koo Kum
Overall (2005): #224,321 of 245,428Top 95%
1
Patents 2005