Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6921971 | Heat releasing member, package for accommodating semiconductor element and semiconductor device | Ryuji Mori, Masahiko Miyauchi | 2005-07-26 |
YB
Yoshihiro Basho
Overall (2005): #72,063 of 245,428Top 30%
1
Patents 2005