Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6921971 | Heat releasing member, package for accommodating semiconductor element and semiconductor device | Yoshihiro Basho, Ryuji Mori | 2005-07-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6921971 | Heat releasing member, package for accommodating semiconductor element and semiconductor device | Yoshihiro Basho, Ryuji Mori | 2005-07-26 |