Issued Patents 2005
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6906414 | Ball grid array package with patterned stiffener layer | Sam Ziqun Zhao | 2005-06-14 |
| 6887741 | Method for making an enhanced die-up ball grid array package with two substrates | Sam Ziqun Zhao, Imtiaz Chaudhry | 2005-05-03 |
| 6879039 | Ball grid array package substrates and method of making the same | Chong Zhong | 2005-04-12 |
| 6876553 | Enhanced die-up ball grid array package with two substrates | Sam Ziqun Zhao, Imtiaz Chaudhry | 2005-04-05 |
| 6861750 | Ball grid array package with multiple interposers | Sam Ziqun Zhao | 2005-03-01 |
| 6853070 | Die-down ball grid array package with die-attached heat spreader and method for making the same | Sam Ziqun Zhao | 2005-02-08 |