Issued Patents 2005
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6906414 | Ball grid array package with patterned stiffener layer | Reza-ur Rahman Khan | 2005-06-14 |
| 6887741 | Method for making an enhanced die-up ball grid array package with two substrates | Reza-ur Rahman Khan, Imtiaz Chaudhry | 2005-05-03 |
| 6882042 | Thermally and electrically enhanced ball grid array packaging | Reaz-ur Rahman Khan, Edward Law, Marc Papageorge | 2005-04-19 |
| 6876553 | Enhanced die-up ball grid array package with two substrates | Reza-ur Rahman Khan, Imtiaz Chaudhry | 2005-04-05 |
| 6861750 | Ball grid array package with multiple interposers | Reza-ur Rahman Khan | 2005-03-01 |
| 6853070 | Die-down ball grid array package with die-attached heat spreader and method for making the same | Reza-ur Rahman Khan | 2005-02-08 |