Issued Patents 2005
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6953708 | Method of producing a semiconductor component having a compliant buffer layer | Harry Hedler, Barbara Vasquez | 2005-10-11 |
| 6936928 | Semiconductor component and method for its production | Harry Hedler | 2005-08-30 |
| 6927157 | Integrated circuit and method for producing a composite comprising a tested integrated circuit and an electrical device | Harry Hedler | 2005-08-09 |
| 6905954 | Method for producing a semiconductor device and corresponding semiconductor device | Harry Hedler, Barbara Vasquez | 2005-06-14 |
| 6888256 | Compliant relief wafer level packaging | Harry Hedler, Barbara Vasquez | 2005-05-03 |
| 6864575 | Electronic interface structures and methods | Harry Hedler | 2005-03-08 |
| 6845554 | Method for connection of circuit units | Gerd Frankowsky, Harry Hedler, Roland Irsigler, Barbara Vasquez | 2005-01-25 |