Issued Patents 2005
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6953708 | Method of producing a semiconductor component having a compliant buffer layer | Harry Hedler, Thorsten Meyer | 2005-10-11 |
| 6919232 | Process for producing a semiconductor chip | Harry Hedler, Roland Irsigler | 2005-07-19 |
| 6916185 | Connection of integrated circuit to a substrate | Harry Hedler | 2005-07-12 |
| 6905954 | Method for producing a semiconductor device and corresponding semiconductor device | Harry Hedler, Thorsten Meyer | 2005-06-14 |
| 6888256 | Compliant relief wafer level packaging | Harry Hedler, Thorsten Meyer | 2005-05-03 |
| 6861291 | Method producing a contact connection between a semiconductor chip and a substrate and the contact connection | Harry Hedler, Roland Irsigler | 2005-03-01 |
| 6845554 | Method for connection of circuit units | Gerd Frankowsky, Harry Hedler, Roland Irsigler, Thorsten Meyer | 2005-01-25 |